光耦可用于替代其前一代使用DIP封装的某些产品。
这些光耦采用流焊设计，这就实现了公共器件于不同产品线中的应用并节省了电路板空间。
★★★ ㊣ 东芝MCU单片机代理、安华高光耦、村田Murata、罗姆、TDK代理，东芝光耦:TLP620,TLP185,TLP181,TLP127,TLP701,TLP2168,TLP2468,TLP2160,TLP627-4,TLP521-4, TLP108,TLP105,TLP180,TLP184,TLP280-4,TLP291-4,TLP281-4,TLP290-4等MOS管:2SK3878,2SK2962,2SK3078A,2SK208-O,2SK209-Y,TK6A80E,TK13A60U，TK4A60D,TK6A60D,TK8A60D,TK10A60D,TK20A60U,TK40J60T,TK50J60U等
二三极管:1SS181,1SS184,1SS187,1SS294,1SS352,1SV324,RN1406,2SA1020-Y等。
单片机:TMPM330FWFG(C,TMPM369FDFG, TMP92CH21FG,TMPM330FYFG(B
逻辑IC: TC7S86F(LM,T TC7S14F,TC7S08F,TC7S04F,TC7SH04F, TC7SH00F
TC4011BF,TC4069UBF,TC4013BF,TC4071BF,TC4081BF,TC4050BP等
电源CMOS稳压器:TCR2EF18(LM,T TCR2EF30,TCR2EF33,TCR2EE50,TCR2EE40等
达林顿驱动:ULN2003AFWG,ULN2803APG,TD62783APG,TD62083AFWG等等