产品介绍DESION
DP-P1500是一款质软型缝隙填充导热垫片，由于其较软的硬度，使其可在低压力的情况下表现出较小的热阻，同时排除元器件和电路板之间的空气，并且充分填充各类粗糙的表面。
DPP1500具有自粘性，不需要额外涂覆粘胶涂层，同时操作简便，可重复利用。
DP-P1500 is soft thermal pad for low thermal resistance at very low pressures. And it allows the pad to fill in air void and air gaps between PC boards and heat sinks or metal chassis with stepped topography,rough surfaces and high stack-up tolerances. DP-P1500 is naturally tacky for reuse,and can be coated the adhesive thing is required.
特点与优势FEATURES AND BENEFITS
◆ 热传导率可达1.5W/mk
◆ Thermal conductivity 1.5W/mk
◆ 广泛应用于低压力情况下
Designed for low-stress applications
◆ 优异的自粘性能
Excellent adhesive properties
◆ 便于操作，可重复利用
Easy handling and converting process,reusable special property.
典型应用APPLICATIONS
◆ 半导体散热装置
Semiconductors to heat sink
◆ 通讯设备
Telecommunications equipment
◆ 显卡
Graphics cards
◆ 记忆存储模块
Memory modules
◆ LED 照明设备
LED solid state lighting
◆ 台式电脑，笔记本电脑，网络服务器
Desktop computers,laptops,servers
◆ 电源设备
Power electronics
操作说明 HANDLING INFORMATION
该产品具有双面自粘性，如需单面粘性产品，可选择后缀为“-D1”的产品。
Material is standard with both sides tacky; the –D1 suffix indicates only one side is tacky.
产品规格 CONFIGURATIONS AVAILABLE
片状产品(标准尺寸= 400mm*200mm)
Sheet form(Standard size=400mm*200mm)
模切产品 Die-cut parts