浩洋牌锡膏是现代印刷电路板级电子组装技术----表面组装技术用之最重要连接材料。本公司一直以开
创国际品牌锡膏为己任，并顺应环境保护之发展新趋势，大力开展系统化科学研究，竭诚为您奉献具有自
主品牌的锡膏系列产品和优良的技术服务。
无铅锡膏 合金成份 Sn-3.5Ag \ Sn-0.7Cu \ Sn-Ag-Cu \Sn-58Bi(低温)
有铅锡膏 合金成份 Sn63/Pb37 、Sn62/Pb36/Ag2 、 Sn43/Pb43/Bi14 、Sn10/Pb88/Ag2
u助焊剂类型: 免洗型锡膏、水溶型锡膏、松香基型锡膏
u锡膏的基本概念与特性
锡膏是由焊料合金粉末与助焊剂/载体系统按照一定比例均匀混合而成的浆状固体；
锡膏的粘度具有流变特性，即在剪切力作用下粘度减小以利于印刷，而印刷之后粘度恢复，从而在再流焊
之前起到固定电子元器件的作用；
在再流焊过程中焊料合金粉末熔化，在助焊剂去除氧化膜的辅助作用下润湿电子元器件外引线端和印刷电
路板焊盘金属表面并发生反应，最终形成二者之间的机械连接和电连接。
u锡膏产品的基本分类
根据焊料合金种类，可分为含铅锡膏与无铅锡膏；
根据清洗方式及有无，可分为松香基锡膏、水溶性锡膏与免清洗锡膏；
根据活性剂种类，可分为纯松香基锡膏、中等活性松香基锡膏、高活性松香基锡膏与有机物基锡膏；
根据涂敷方式，可分为范本印刷用锡膏、丝网印刷用锡膏与滴注用锡膏。
u锡膏发展的重要进程
1940年代:印刷电路板组装技术在二次世界大战中出现并逐渐普及；
1950年代:通孔插装的群焊技术 ---- 波峰焊技术出现；
1960年代:表面组装用片式阻容组件出现；
1971年:Philips公司推出小外形封装集成电路，表面组装概念确立并迅速得到推广应用；
1985年:大气臭氧层发现空洞；
1987年:《蒙特利尔公约》签署，松香基锡膏的主要清洗溶剂----氯氟碳化物的使用受到限制并最终被禁
止使用。水溶性锡膏与免清洗概念开始受到重视；
1990年代:全球气候变暖，温室效应逐年明显；
2002年:《京都协议书》签署，要求逐渐减少挥发性有机物质的使用。低VOC和VOC-Free锡膏的概念开始
受到重视。
u锡膏的保存
用户方收到本公司的锡膏产品后请立即放入冰箱，在3-7℃ 下进行冷藏保存。请注意不可以对锡膏进行冷
冻保存。
另一方面，锡膏开封使用之后如果还有剩余且希望在下一轮组装过程中继续使用而不是废弃，请再次将该
锡膏容器密封，但是不可以放入冰箱内保存，而只是放置在室温环境下即可。
u锡膏印刷前的准备
锡膏从冰箱中取出，投入印刷工序之前一定要进行以下2个步骤的操作:
（1）不要开封，在室温下放置至少4-6个小时以上，以使锡膏的温度自然回升至室温。
（2）锡膏温度达到室温之后，在投入印刷之前，要进行搅拌以保证锡膏中的各组成成分均匀分布。建议
采用专用搅拌设备，沿同一方向搅拌1-3分钟即可。
u锡膏的使用原则
先进先出，即在保证性能满足要求的前提下，首先使用库存时间最长的产品。
使用以前剩下的锡膏时应与新锡膏按1:1比例混合使用，而不能完全使用“旧”的锡膏。
相关产品:
普通锡膏 63/37锡膏 含银锡膏 无铅锡膏
高温锡膏 SMT专用锡膏 低温锡膏
Hao Yang licensing paste is the modern printed circuit board level electronics assembly technology - surface mount technology is the most important connection material. The company has always been to open
Creating international brands paste as their responsibility, and conform to the new trend of the development of environmental protection, vigorously carry out systematic scientific research, sincerely for your dedication and self
The main brands of solder paste products and excellent technical services.
Lead-free solder paste alloy composition of Sn-3.5Ag \ Sn-0.7Cu \ Sn-Ag-Cu \ Sn-58Bi ( low temperature )
Have lead solder paste alloy composition of Sn63 / Pb37, Sn62 / Pb36 / Ag2, Sn43 / Pb43 / Bi14, Sn10 / Pb88 / Ag2
U flux type: disposable type solder paste, solder paste, water soluble rosin type solder paste
U basic concept and characteristic of solder paste
Solder paste is made up of solder alloy powder and flux / vector system in certain proportion mixed slurry solid;
Solder paste viscosity has rheological characteristics, namely, under the action of shear stress viscosity decreased in favor of printing, and printing viscosity recovery, resulting in a reflow soldering
Prior to fix the electronic components of the role;
In the process of reflow soldering of the solder alloy powder in the flux melting, removal of oxide film under the auxiliary function of wetting the component terminal and printed circuit
Road board pads metal surface and reaction between the two, eventually forming a mechanical and electrical connection.
The basic classification of u solder paste product
According to the solder alloy type, can be divided into lead and lead-free solder paste;
By cleaning method, can be divided into rosin-based solder paste, solder paste no-clean solder paste with water soluble;
According to the surfactant type, can be divided into pure rosin solder paste, solder paste, moderate activity rosin rosin activated radicals and organic based solder paste solder paste;
By applying method, can be divided into the template for printing solder paste, screen printing paste and infusion paste.
U solder paste development important process
The 1940's: printed circuit board assembly technology in the two World War and popularization;
The 1950's: tht group welding technology -- wave soldering technology;
1960's: for surface mount chip resistor capacitor components appear;
1971: Philips launched small outline integrated circuit, surface assembly concept established and rapidly spreading;
1985: the atmospheric ozone layer found empty;
1987:" Montreal Convention" sign, rosin-based solder paste cleaning solvent ---- chloride fluoride carbide using restricted and eventually banned
Check the use of. Water soluble solder paste no-clean concept and began to receive attention;
The 1990's: global warming, greenhouse effect has obvious;
2002: the" Kyoto Protocol" sign, requirements gradually reduced volatile organic substances using. Low VOC and VOC-Free solder paste begins with the concept of
Attention.
U solder paste save
Users received the company's solder paste immediately after the refrigerator, cold storage preservation in 3-7 DEG c.. Please note not to paste cold
Freeze preservation.
On the other hand, solder paste Kaifeng after use if there is surplus and hope in the next round of the assembly process continue to use instead of the waste, please again
Solder paste container seal, but can not be put into a refrigerator, and is placed in the room temperature.
U solder paste printing preparation
Solder paste inputs from the fridge, printing process must be done before the following 2 steps:
( 1) Kaifeng, at room temperature for at least 4-6 hours, so that the solder paste temperature natural pick up to room temperature.
( 2) the solder paste temperature up to room temperature, before printing in stirring to ensure, to paste the compositions of uniform distribution. Suggestion
Using a special stirring device, along the same direction mixing 1-3 minutes.
The principle of using U solder paste
FIFO, namely in the guarantee performance to meet the requirements of the premise, the first use of inventory for the longest time product.
The rest of the solder paste should be used before and the new paste by 1: 1 ratio of mixed use, but can not be completely using the" old" paste.
Related products:
63 / 37 ordinary solder paste solder paste containing silver solder paste lead-free solder paste
SMT high temperature solder paste special paste low temperature paste